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| www..com K4D263238I-VC 128M GDDR SDRAM 128Mbit GDDR SDRAM Revision 1.3 November 2006 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.3 November 2006 www..com K4D263238I-VC Revision History Revision 0.0 0.1 1.0 1.1 1.2 1.3 Month May September October December January November Year 2005 2005 2005 2005 2006 2006 - Target Spec - Defined target specification - Added current spec - Added IBIS spec - Finalized SPEC History 128M GDDR SDRAM - Change from tRRD=15ns / tWR=20ns to tRRD= 10ns / tWR=15ns for -VC40(250MHz) - Modified ICC6 value from 7mA to 10mA - Corrected typo -2- Rev. 1.3 November 2006 www..com K4D263238I-VC 128M GDDR SDRAM 1M x 32Bit x 4 Banks Double Data Rate Synchronous DRAM with Bi-directional Data Strobe and DLL FEATURES * 2.5V 5% power supply for device operation * 2.5V 5% power supply for I/O interface * SSTL_2 compatible inputs/outputs * 4 banks operation * MRS cycle with address key programs -. Read latency 3 (clock) -. Burst length (2, 4, 8 and Full page) -. Burst type (sequential & interleave) * Full page burst length for sequential burst type only * Start address of the full page burst should be even * All inputs except data & DM are sampled at the positive going edge of the system clock * Differential clock input * Write Interrupted by Read function * Data I/O transactions on both edges of Data strobe * DLL aligns DQ and DQS transitions with Clock transition * Edge aligned data & data strobe output * Center aligned data & data strobe input * DM for write masking only * Auto & Self refresh * 32ms refresh period (4K cycle) * 144pin FBGA package * Maximum clock frequency up to 250MHz * Maximum data rate up to 500Mbps/pin ORDERING INFORMATION Part NO. K4D263238I-VC40 K4D263238I-VC50 Max Freq. 250MHz 200MHz Max Data Rate 500Mbps/pin 400Mbps/pin Interface SSTL_2 Package 144FBGA K4D263238I-VC is the Lead Free package part number. GENERAL DESCRIPTION FOR 1M x 32Bit x 4 Bank DDR SDRAM The K4D263238I is 134,217,728 bits of hyper synchronous data rate Dynamic RAM organized as 4 x 1,048,576 words by 32 bits, fabricated with SAMSUNGs high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 2.0GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications. -3- Rev. 1.3 November 2006 www..com K4D263238I-VC PIN CONFIGURATION (Top View) 2 B C D E F G H J K L M N DQS0 DQ4 DQ6 DQ7 DQ17 DQ19 DQS2 DQ21 DQ22 CAS RAS CS 128M GDDR SDRAM 3 DM0 VDDQ DQ5 VDDQ DQ16 DQ18 DM2 DQ20 DQ23 WE NC NC 4 VSSQ NC VSSQ VDD VDDQ VDDQ NC VDDQ VDDQ VDD NC BA0 5 DQ3 VDDQ VSSQ VSS VSSQ VSSQ VSSQ VSSQ VSSQ VSS BA1 A0 6 DQ2 DQ1 VSSQ VSSQ 7 DQ0 VDDQ VDD VSS 8 DQ31 VDDQ VDD VSS 9 DQ29 DQ30 VSSQ VSSQ 10 DQ28 VDDQ VSSQ VSS VSSQ VSSQ VSSQ VSSQ VSSQ VSS RFU2 A7 11 VSSQ NC VSSQ VDD VDDQ VDDQ NC VDDQ VDDQ VDD CK A8/AP 12 DM3 VDDQ DQ26 VDDQ DQ15 DQ13 DM1 DQ11 DQ9 NC CK CKE 13 DQS3 DQ27 DQ25 DQ24 DQ14 DQ12 DQS1 DQ10 DQ8 NC MCL VREF VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS A10 A2 A1 VSS VDD A11 A3 VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS VSS Thermal Thermal VSS VDD A9 A4 VSS RFU1 A5 A6 NOTE: 1. RFU1 is reserved for A12 2. RFU2 is reserved for BA2 3. VSS Thermal balls are optional PIN DESCRIPTION CK,CK CKE CS RAS CAS WE DQS DM RFU Differential Clock Input Clock Enable Chip Select Row Address Strobe Column Address Strobe Write Enable Data Strobe Data Mask Reserved for Future Use BA0, BA1 A0 ~A11 DQ0 ~ DQ31 VDD VSS VDDQ VSSQ NC MCL Bank Select Address Address Input Data Input/Output Power Ground Power for DQ's Ground for DQ's No Connection Must Connect Low -4- Rev. 1.3 November 2006 www..com K4D263238I-VC INPUT/OUTPUT FUNCTIONAL DESCRIPTION Symbol CK, CK*1 Input Type 128M GDDR SDRAM Function The differential system clock Input. All of the inputs are sampled on the rising edge of the clock except DQs and DMs that are sampled on both edges of the DQS. Activates the CK signal when high and deactivates the CK signal when low. By deactivating the clock, CKE low indicates the Power down mode or Self refresh mode. CS enables the command decoder when low and disabled the command decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. Latches row addresses on the positive going edge of the CK with RAS low. Enables row access & precharge. Latches column addresses on the positive going edge of the CK with CAS low. Enables column access. Enables write operation and row precharge. Latches data in starting from CAS, WE active. Data input and output are synchronized with both edge of DQS. Data In mask. Data In is masked by DM Latency=0 when DM is high in burst write. DM0 for DQ0 ~ DQ7, DM1 for DQ8 ~ DQ15, DM2 for DQ16 ~ DQ23, DM3 for DQ24 ~ DQ31. Data inputs/Outputs are multiplexed on the same pins. Selects which bank is to be active. Row/Column addresses are multiplexed on the same pins. Row addresses : RA0 ~ RA11, Column addresses : CA0 ~ CA7. Column address CA8 is used for auto precharge. Power and ground for the input buffers and core logic. Isolated power supply and ground for the output buffers to provide improved noise immunity. Reference voltage for inputs, used for SSTL interface. Must connect Low CKE Input CS Input RAS CAS WE DQS DM0 ~ DM3 DQ0 ~ DQ31 BA0, BA1 A0 ~ A11 VDD/VSS VDDQ/VSSQ VREF MCL Input Input Input Input/Output Input Input/Output Input Input Power Supply Power Supply Power Supply Must Connect Low *1 : The timing reference point for the differential clocking is the cross point of CK and CK. For any applications using the single ended clocking, apply VREF to CK pin. -5- Rev. 1.3 November 2006 www..com K4D263238I-VC BLOCK DIAGRAM (1Mbit x 32I/O x 4 Bank) 128M GDDR SDRAM 32 Intput Buffer I/O Control LWE LDMi CK, CK Bank Select Data Input Register Serial to parallel 64 1Mx32 Output Buffer 2-bit prefetch Sense AMP Refresh Counter Row Buffer Row Decoder 1Mx32 1Mx32 1Mx32 64 32 x32 DQi Address Register CK,CK ADDR Column Decoder LCBR LRAS Col. Buffer Latency & Burst Length Strobe Gen. Data Strobe LCKE Programming Register LRAS LCBR LWE LCAS LWCBR DLL CK,CK LDMi Timing Register CK,CK CKE CS RAS CAS WE DMi -6- Rev. 1.3 November 2006 www..com K4D263238I-VC FUNCTIONAL DESCRIPTION * Power-Up Sequence 128M GDDR SDRAM DDR SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. 1. Apply power and keep CKE at low state (All other inputs may be undefined) - Apply VDD before VDDQ . - Apply VDDQ before VREF & VTT 2. Start clock and maintain stable condition for minimum 200us. 3. The minimum of 200us after stable power and clock(CK,CK ), apply NOP and take CKE to be high. 4. Issue precharge command for all banks of the device. 5. Issue a EMRS command to enable DLL *1 6. Issue a MRS command to reset DLL. The additional 200 clock cycles are required to lock the DLL. *1,2 7. Issue precharge command for all banks of the device. 8. Issue at least 2 or more auto-refresh commands. 9. Issue a mode register set command with A8 to low to initialize the mode register. *1 The additional 200cycles of clock input is required to lock the DLL after enabling DLL. *2 Sequence of 6&7 is regardless of the order. Power up & Initialization Sequence CK CK Command 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 tRP precharge ALL Banks 2 Clock min. EMRS 2 Clock min. precharge ALL Banks tRP 1st Auto Refresh tRFC 2nd Auto Refresh tRFC Mode 2 Clock min. Any Command MRS DLL Reset Register Set Inputs must be stable for 200us * When the operating frequency is changed, DLL reset should be required again. After DLL reset again, the minimum 200 cycles of clock input is needed to lock the DLL. Rev. 1.3 November 2006 200 Clock min. -7- www..com K4D263238I-VC MODE REGISTER SET(MRS) 128M GDDR SDRAM The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after EMRS setting for proper operation. The mode register is written by asserting low on CS, RAS, CAS and WE(The DDR SDRAM should be in active mode with CKE already high prior to writing into the mode register). The state of address pins A0 ~ A11 and BA0, BA1 in the same cycle as CS, RAS, CAS and WE going low is written in the mode register. Minimum two clock cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2, addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used for test mode. A8 is used for DLL reset. A7,A8, BA0 and BA1 must be set to low for normal MRS operation. Refer to the table for specific codes for various burst length, addressing modes and CAS latencies. BA1 RFU BA0 0 A11 A10 RFU A9 A8 DLL A7 TM A6 A5 A4 A3 BT A2 A1 Burst Length A0 Address Bus Mode Register CAS Latency Burst Type DLL A8 0 1 DLL Reset No Yes Test Mode A7 0 1 mode Normal Test Burst Length CAS Latency BA0 0 1 An ~ A0 MRS EMRS A6 0 0 0 * RFU(Reserved for future use) should stay "0" during MRS cycle. 0 1 1 1 1 MRS Cycle 0 CK, CK Command NOP Precharge All Banks NOP NOP MRS NOP Any Command NOP NOP A3 0 1 Type Sequential Interleave A5 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 Latency Reserved Reserved Reserved 3 Reserved Reserved Reserved Reserved A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Burst Type Sequential Reserve 2 4 8 Reserve Reserve Reserve Full page Interleave Reserve 2 4 8 Reserve Reserve Reserve Reserve 1 2 3 4 5 6 7 8 tRP tMRD=2 tCK *1: MRS can be issued only at all banks precharge state. *2: Minimum tRP is required to issue MRS command. -8- Rev. 1.3 November 2006 www..com K4D263238I-VC EXTENDED MODE REGISTER SET(EMRS) 128M GDDR SDRAM The extended mode register stores the data for enabling or disabling DLL and selecting output driver strength. The default value of the extended mode register is not defined, therefore the extend mode register must be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the extended mode register). The state of address pins A0, A2 ~ A5, A7 ~ A11 and BA1 in the same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. A1 and A6 are used for setting driver strength to weak or matched impedance. Two clock cycles are required to complete the write operation in the extended mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address pins except A0,A1,A6 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific codes. BA1 RFU BA0 1 A11 A10 A9 RFU A8 A7 A6 D.I.C A5 A4 RFU A3 A2 A1 D.I.C A0 DLL Address Bus Extended Mode Register BA0 0 1 An ~ A0 MRS EMRS A6 0 0 1 1 A1 0 1 0 1 Output Driver Impedance Control Full Weak N/A Matched 100% 60% Do not use 30% A0 0 1 DLL Enable Enable Disable * RFU(Reserved for future use) should stay "0" during EMRS cycle. Figure 7. Extend Mode Register set -9- Rev. 1.3 November 2006 www..com K4D263238I-VC IBIS : Pull up Voltage 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Pullup Current(mA) 100% Min 100% Max 0 0 -5.688 -8.096 -11.232 -15.796 -16.596 -23.496 -21.636 -31.108 -26.64 -38.28 -31.14 -45.144 -35.496 -51.92 -39.456 -58.344 -43.128 -64.372 -46.224 -70.224 -48.996 -75.636 -51.336 -80.52 -53.244 -85.052 -54.828 -88.968 -56.088 -92.224 -57.168 -94.919 -58.104 -96.844 -58.86 -99.187 -59.616 -100.562 -60.228 -101.893 -60.84 -102.63 -61.38 -103.411 -61.497 -104.544 -61.821 -105.303 -61.947 -105.644 -62.01 -106.392 -62.208 -106.392 Pullup Current(mA) 60% Min 60% Max 0 0 -5.076 -7.216 -9.936 -14.168 -14.544 -20.988 -19.08 -27.72 -23.256 -34.1 -27.216 -40.26 -30.924 -46.288 -34.344 -51.832 -37.404 -57.156 -40.104 -62.304 -42.408 -66.836 -44.352 -71.016 -45.972 -74.844 -47.304 -78.232 -48.384 -81.136 -49.284 -83.6 -50.04 -85.756 -50.724 -87.472 -51.3 -88.924 -51.84 -89.617 -52.344 -90.849 -52.776 -91.564 -53.181 -92.037 -53.487 -92.774 -53.631 -92.807 -53.64 -93.06 -53.694 -93.126 Pull up 128M GDDR SDRAM Pullup Current(mA) 30% Min 30% Max 0 0 -3.672 -5.148 -7.2 -10.34 -10.548 -15.224 -13.752 -20.02 -16.776 -24.64 -19.584 -29.04 -22.212 -33.352 -24.66 -37.4 -26.856 -41.184 -28.728 -44.792 -30.456 -48.004 -31.86 -51.04 -33.048 -53.724 -33.984 -55.968 -34.812 -58.08 -35.496 -59.84 -36.072 -61.292 -36.612 -62.524 -36.873 -63.668 -37.152 -64.504 -37.53 -65.34 -37.773 -65.956 -37.989 -66.66 -38.385 -67.232 -38.781 -67.76 -38.853 -68.244 -38.988 -68.684 -20 -40 -60 -80 -100 -120 Voltage (V) 100% Min 100% Max 60% Min 60% Max 30% Min 30% Max Current (mA) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 - 10 - 0 Rev. 1.3 November 2006 www..com K4D263238I-VC IBIS : Pull down Voltage 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Pulldown Current(mA) 100% Min 100% Max 0 0 6.984 9.1795 13.86 17.193 20.448 25.036 26.82 32.714 32.832 40.205 38.484 47.487 43.632 54.538 48.384 61.347 52.56 67.881 56.088 74.129 58.896 80.058 61.02 85.635 62.604 90.816 63.756 95.568 64.548 99.825 65.124 103.532 65.628 106.579 65.988 108.922 66.312 110.66 66.6 112.002 66.816 112.992 67.068 113.762 67.284 114.422 67.464 115.082 67.608 115.632 67.824 116.072 67.968 116.512 Pulldown Current(mA) 60% Min 60% Max 0 0 6.048 8.624 12.132 17.16 17.748 25.388 23.256 33.616 28.476 41.404 33.336 49.104 37.908 56.628 41.976 63.492 45.432 70.18 48.348 76.208 50.688 81.532 52.452 86.196 53.748 90.2 54.684 93.841 55.332 96.481 55.8 98.34 56.232 99.077 56.52 100.177 56.808 100.782 57.06 101.167 57.312 101.552 57.456 101.739 57.636 102.245 57.852 102.553 58.032 102.828 58.176 102.861 58.32 102.905 Pull down 140 120 Current (mA) 100 80 60 40 20 128M GDDR SDRAM Pulldown Current(mA) 30% Min 30% Max 0 0 3.708 5.28 7.38 10.56 10.836 15.532 14.076 20.68 17.172 25.3 19.944 30.096 22.5 34.408 24.624 38.5 26.424 42.196 27.828 45.452 28.908 48.18 29.664 50.468 30.24 52.228 30.672 53.548 30.924 54.604 31.212 55.352 31.356 55.924 31.536 56.32 31.68 56.628 31.824 56.892 31.932 57.156 32.076 57.376 32.184 57.508 32.292 57.728 32.364 57.816 32.436 57.992 32.58 58.124 100% Min 100% Max 60% Min 60% Max 30% Min 30% Max 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Voltage (V) - 11 - 0 Rev. 1.3 November 2006 www..com K4D263238I-VC ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on VDD supply relative to Vss Voltage on VDD supply relative to Vss Storage temperature Power dissipation Short circuit current Symbol VIN, VOUT VDD VDDQ TSTG PD IOS 128M GDDR SDRAM Value -0.5 ~ 3.6 -1.0 ~ 3.6 -0.5 ~ 3.6 -55 ~ +150 1.8 50 Unit V V V C W mA Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. POWER & DC OPERATING CONDITIONS(SSTL_2 In/Out) Recommended operating conditions(Voltage referenced to VSS=0V, TA=0 to 65C) Parameter Device Supply voltage Output Supply voltage Reference voltage Termination voltage Input logic high voltage Input logic low voltage Output logic high voltage Output logic low voltage Input leakage current Output leakage current Symbol VDD VDDQ VREF Vtt VIH VIL VOH VOL IIL IOL Min 2.375 2.375 0.49*VDDQ VREF-0.04 VREF+0.15 -0.30 Vtt+0.76 -5 -5 Typ 2.50 2.50 VREF - Max 2.625 2.625 0.51*VDDQ VREF+0.04 VDDQ+0.30 VREF-0.15 Vtt-0.76 5 5 Unit V V V V V V V V uA uA Note 1 1 2 3 4 5 IOH=-15.2mA IOL=+15.2mA 6 6 Note : 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VREF is expected to equal 0.50*VDDQ of the transmitting device and to track variations in the DC level of the same. Peak to peak noise on the VREF may not exceed + 2% of the DC value. Thus, from 0.50*VDDQ, VREF is allowed + 25mV for DC error and an additional + 25mV for AC noise. 3. Vtt of the transmitting device must track VREF of the receiving device. 4. VIH(max.)= VDDQ +1.5V for a pulse and it which can not be greater than 1/3 of the cycle rate. 5. VIL(min.)= -1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate. 6. For any pin under test input of 0V VIN VDD is acceptable. For all other pins that are not under test VIN=0V. - 12 - Rev. 1.3 November 2006 www..com K4D263238I-VC Recommended operating conditions Unless Otherwise Noted, TA=0 to 65C) Parameter Operating Current (One Bank Active) Precharge Standby Current in Power-down mode Precharge Standby Current in Non Power-down mode Active Standby Current power-down mode Active Standby Current in in Non Power-down mode Operating Current ( Burst Mode) Refresh Current Self Refresh Current Symbol ICC1 ICC2P ICC2N ICC3P ICC3N ICC4 ICC5 ICC6 Test Condition Burst Lenth=2 tRC tRC(min) 128M GDDR SDRAM DC CHARACTERISTICS Version -40 189 11 48 78 153 402 159 10 -50 170 11 43 67 134 344 135 Unit Note IOL=0mA, tCC= tCC(min) CKE VIL(max), tCC= tCC(min) CKE VIH(min), CS VIH(min), mA mA mA mA mA mA mA mA 1 tCC= tCC(min). CKE VIL(max), tCC= tCC(min) CKE VIH(min), CS VIH(min), tCC= tCC(min) . IOL=0mA ,tCC= tCC(min), Page Burst, All Banks activated. tRC tRFC(min) CKE 0.2V 2 Note: 1. Measured with outputs open. 2. Refresh period is 32ms. AC INPUT OPERATING CONDITIONS Recommended operating conditions(Voltage referenced to VSS=0V, VDD/ VDDQ=2.5V+ 5%, TA=0 to 65C) Parameter Input High (Logic 1) Voltage; DQ Input Low (Logic 0) Voltage; DQ Clock Input Differential Voltage; CK and CK Clock Input Crossing Point Voltage; CK and CK Symbol VIH VIL VID VIX Min VREF+0.35 0.7 0.5*VDDQ-0.2 Typ - Max VREF-0.35 VDDQ+0.6 0.5*VDDQ+0.2 Unit V V V V Note 1 2 Note : 1. VID is the magnitude of the difference between the input level on CK and the input level on CK 2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same - 13 - Rev. 1.3 November 2006 www..com K4D263238I-VC Parameter Input reference voltage for CK(for single ended) CK and CK signal maximum peak swing CK signal minimum slew rate Input Levels(VIH/VIL) Input timing measurement reference level Output timing measurement reference level Output load condition Value 0.50*VDDQ 1.5 1.0 128M GDDR SDRAM Unit V V V/ns V V V Note AC OPERATING TEST CONDITIONS (VDD/ VDDQ=2.5V+ 5% , TA= 0 to 65C) VREF+0.35/VREF-0.35 VREF Vtt See Fig.1 Vtt=0.5*VDDQ RT=50 Output Z0=50 CLOAD=30pF VREF =0.5*VDDQ (Fig. 1) Output Load Circuit CAPACITANCE (VDD=2.5V, TA= 25C, f=1MHz) Parameter Input capacitance( CK, CK ) Input capacitance(A0~A11, BA0~BA1) Input capacitance ( CKE, CS, RAS,CAS, WE ) Data & DQS input/output capacitance(DQ0~DQ31) Input capacitance(DM0 ~ DM3) Symbol CIN1 CIN2 CIN3 COUT CIN4 Min 1.0 1.0 1.0 1.0 1.0 Max 5.0 4.0 4.0 6.0 6.0 Unit pF pF pF pF pF DECOUPLING CAPACITANCE GUIDE LINE Recommended decoupling capacitance added to power line at board. Parameter Decoupling Capacitance between VDD and VSS Decoupling Capacitance between VDDQ and VSSQ Symbol CDC1 CDC2 Value 0.1 + 0.01 0.1 + 0.01 Unit uF uF Note : 1. VDD and VDDQ pins are separated each other. All VDD pins are connected in chip. All VDDQ pins are connected in chip. 2. VSS and VSSQ pins are separated each other All VSS pins are connected in chip. All VSSQ pins are connected in chip. - 14 - Rev. 1.3 November 2006 www..com K4D263238I-VC AC CHARACTERISTICS Parameter CK cycle time CL=3 CK high level width CK low level width DQS out access time from CK Output access time from CK Data strobe edge to Dout edge Read preamble Read postamble CK to valid DQS-in DQS-In setup time DQS-in hold time DQS write postamble DQS-In high level width DQS-In low level width Address and Control input setup Address and Control input hold DQ and DM setup time to DQS DQ and DM hold time to DQS Clock half period Data output hold time from DQS Symbol tCK tCH tCL tDQSCK tAC tDQSQ tRPRE tRPST tDQSS tWPRES tWPREH tWPST tDQSH tDQSL tIS tIH tDS tDH tHP tQH -40 Min 4.0 0.45 0.45 -0.6 -0.6 0.9 0.4 0.85 0 0.35 0.4 0.4 0.4 0.9 0.9 0.4 0.4 tCLmin or tCHmin tHP-0.4 Max 10 0.55 0.55 0.6 0.6 0.4 1.1 0.6 1.15 0.6 0.6 0.6 - 128M GDDR SDRAM -50 Min 5.0 0.45 0.45 -0.7 -0.7 0.9 0.4 0.8 0 0.25 0.4 0.4 0.4 1.0 1.0 0.45 0.45 tCLmin or tCHmin tHP-0.45 Max 10 0.55 0.55 +0.7 +0.7 +0.45 1.1 0.6 1.2 0.6 0.6 0.6 - Unit ns tCK tCK ns ns ns tCK tCK tCK ns tCK tCK tCK tCK ns ns ns ns ns ns Note Simplified Timing @ BL=2, CL=3 tCH tCL tCK 0 CK, CK CS 1 2 3 4 5 6 7 8 tIS tIH tDQSCK tDQSS tDQSH tWPST DQS tRPRE tRPST tWPREH tWPRES tDS tDH Hi-Z tDQSQ tAC DQ DM COMMAND READA Da1 Da2 Db0 Db1 Hi-Z WRITEB - 15 - Rev. 1.3 November 2006 www..com K4D263238I-VC 128M GDDR SDRAM Note 1 : - The JEDEC DDR specification currently defines the output data valid window(tDV) as the time period when the data strobe and all data associated with that data strobe are coincidentally valid. - The previously used definition of tDV(=0.35tCK) artificially penalizes system timing budgets by assuming the worst case output valid window even then the clock duty cycle applied to the device is better than 45/55% - A new AC timing term, tQH which stands for data output hold time from DQS is defined to account for clock duty cycle variation and replaces tDV - tQHmin = tHP-X where . tHP=Minimum half clock period for any given cycle and is defined by clock high or clock low time(tCH,tCL) . X=A frequency dependent timing allowance account for tDQSQmax tQH Timing (CL3, BL2) tHP 0 CK, CK CS 1 2 3 4 5 DQS tDQSQ(max) tQH tDQSQ(max) DQ Da0 Da1 COMMAND READA - 16 - Rev. 1.3 November 2006 www..com K4D263238I-VC AC CHARACTERISTICS (I) Parameter Row cycle time Refresh row cycle time Row active time RAS to CAS delay for Read RAS to CAS delay for Write Row precharge time Row active to Row active Last data in to Row precharge Last data in to Row precharge @Auto Precharge Auto precharge write recovery + Precharge Last data in to Read command Col. address to Col. address Mode register set cycle time Exit self refresh to read command Power down exit time Refresh interval time Symbol tRC tRFC tRAS tRCDRD tRCDWR tRP tRRD tWR tWR_A tDAL tCDLR tCCD tMRD tXSR tPDEX tREF -40 Min 48 56 32 16 8 16 10 15 3 7 2 1 2 200 3tCK+tIS Max 100K 7.8 128M GDDR SDRAM -50 Min 50 55 35 15 10 15 10 15 3 6 2 1 2 200 3tCK+tIS Max 100K 7.8 Unit Note ns ns ns ns ns ns ns ns tCK tCK tCK tCK tCK tCK ns us 2,5 5 5 5 4 5 5 5 3 3,5 1 Note : 1. For normal write operation, even numbers of Din are to be written inside DRAM 2. The number of clock of tRP is restricted by the number of clock of tRAS and tRP 3. The number of clock of tWR_A is fixed. It can't be changed by tCK 4. tRCDWR is equal to tRCDRD-2tCK and the number of clock can not be lower than 2tCK. 5. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer unconditionally. AC CHARACTERISTICS (II) K4D263238I-VC40 Frequency 250MHz ( 4.0ns ) 200MHz ( 5.0ns ) 166MHz ( 6.0ns ) Cas Latency 3 3 3 tRC 12 10 9 tRFC 14 11 9 tRAS 8 7 6 tRCDRD tRCDWR 4 2 3 2 3 2 tRP 4 3 3 tRRD 3 2 2 tDAL 7 6 6 Unit tCK tCK tCK K4D263238I-VC50 Frequency 200MHz ( 5.0ns ) 166MHz ( 6.0ns ) Cas Latency 3 3 tRC 10 9 tRFC 11 9 tRAS 7 6 tRCDRD tRCDWR 3 2 3 2 tRP 3 3 tRRD 2 2 tDAL 6 6 Unit tCK tCK * 200/166MHz are supported in K4D263238I-VC40 * 166MHz is supported in K4D263238I-VC50 - 17 - Rev. 1.3 November 2006 www..com K4D263238I-VC Simplified Timing(2) @ BL=4, CL=3 0 CK, CK 128M GDDR SDRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 BA[1:0] BAa BAa BAa BAa BAb BAa BAb A8/AP ADDR (A0~A7, A9~,A11) WE Ra Ra Ca Ra Rb Ra Rb Ca Cb DQS DQ Da0 Da1 Da2 Da3 Da0 Da1 Da2 Da3 Db0 Db1 Db2 Db3 DM COMMANDACTIVEA WRITEA tRCD tRAS tRC PRECH tRP ACTIVEA ACTIVEB WRITEA WRITEB tRRD Normal Write Burst (@ BL=4) Multi Bank Interleaving Write Burst (@ BL=4) - 18 - Rev. 1.3 November 2006 www..com K4D263238I-VC PACKAGE DIMENSIONS (144-Ball FBGA) A1 INDEX MARK 128M GDDR SDRAM 12.0 12.0 0.10 Max 0.8x11=8.8 0.8 B C D E F G H J K L M N A1 INDEX MARK 0.8 0.8x11=8.8 0.45 0.05 0.40 13 12 11 10 9 8 7 6 5 4 3 2 0.35 0.05 1.40 Max 0.40 Unit : mm - 19 - Rev. 1.3 November 2006 |
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